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Impact of wafer thinning on ESD protection devices in 3D integrated systems

dc.contributor.authorScholz, Mirko
dc.contributor.authorVaisman Chasin, Adrian
dc.contributor.authorLinten, Dimitri
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T14:42:21Z
dc.date.available2021-10-23T14:42:21Z
dc.date.issued2016-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27282
dc.sourceIIOimport
dc.titleImpact of wafer thinning on ESD protection devices in 3D integrated systems
dc.typeMeeting abstract
dc.contributor.imecauthorVaisman Chasin, Adrian
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVaisman Chasin, Adrian::0000-0002-9940-0260
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.beginpageC5
dc.source.conferenceInternational ESD Workshop - IEW
dc.source.conferencedate16/05/2016
dc.source.conferencelocationTutzing Germany
imec.availabilityPublished - imec


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