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dc.contributor.authorTeugels, Lieve
dc.contributor.authorDevriendt, Katia
dc.contributor.authorHeylen, Nancy
dc.contributor.authorTsvetanova, Diana
dc.contributor.authorStruyf, Herbert
dc.contributor.authorBast, Gerhard
dc.contributor.authorRamkhalawon, Roshita
dc.contributor.authorMueller, Dieter
dc.contributor.authorSimpson, Gavin
dc.contributor.authorUlea, Neli
dc.date.accessioned2021-10-23T15:31:19Z
dc.date.available2021-10-23T15:31:19Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27388
dc.sourceIIOimport
dc.titleWithin-die and within-wafer CMP process characterization and monitoring using PWG Fizeau interferometry system
dc.typeMeeting abstract
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorTsvetanova, Diana
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorBast, Gerhard
dc.contributor.imecauthorSimpson, Gavin
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.source.peerreviewyes
dc.source.conferenceInternational Conference on Planarization Technology - ICPT
dc.source.conferencedate17/10/2016
dc.source.conferencelocationBeijing China
dc.identifier.urlhttp://www.canevent.com/upload/microInvite/file/8491/1476432747021046704.pdf
imec.availabilityPublished - imec


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