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Within-die and within-wafer CMP process characterization and monitoring using PWG Fizeau interferometry system

dc.contributor.authorTeugels, Lieve
dc.contributor.authorDevriendt, Katia
dc.contributor.authorHeylen, Nancy
dc.contributor.authorTsvetanova, Diana
dc.contributor.authorStruyf, Herbert
dc.contributor.authorBast, Gerhard
dc.contributor.authorRamkhalawon, Roshita
dc.contributor.authorMueller, Dieter
dc.contributor.authorSimpson, Gavin
dc.contributor.authorUlea, Neli
dc.date.accessioned2021-10-23T15:31:19Z
dc.date.available2021-10-23T15:31:19Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27388
dc.sourceIIOimport
dc.titleWithin-die and within-wafer CMP process characterization and monitoring using PWG Fizeau interferometry system
dc.typeMeeting abstract
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorTsvetanova, Diana
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorBast, Gerhard
dc.contributor.imecauthorSimpson, Gavin
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.source.peerreviewyes
dc.source.conferenceInternational Conference on Planarization Technology - ICPT
dc.source.conferencedate17/10/2016
dc.source.conferencelocationBeijing China
dc.identifier.urlhttp://www.canevent.com/upload/microInvite/file/8491/1476432747021046704.pdf
imec.availabilityPublished - imec


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