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Impact of wafer thinning on front-end reliability for 3D integration
Publication:
Impact of wafer thinning on front-end reliability for 3D integration
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Date
2016
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vaisman Chasin, Adrian
;
Scholz, Mirko
;
Guo, Wei
;
Franco, Jacopo
;
Potoms, Goedele
;
Jourdain, Anne
;
Linten, Dimitri
;
Van der Plas, Geert
;
Absil, Philippe
;
Beyne, Eric
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1913
since deposited on 2021-10-23
Acq. date: 2025-12-16
Citations
Metrics
Views
1913
since deposited on 2021-10-23
Acq. date: 2025-12-16
Citations