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Impact of wafer thinning on front-end reliability for 3D integration

dc.contributor.authorVaisman Chasin, Adrian
dc.contributor.authorScholz, Mirko
dc.contributor.authorGuo, Wei
dc.contributor.authorFranco, Jacopo
dc.contributor.authorPotoms, Goedele
dc.contributor.authorJourdain, Anne
dc.contributor.authorLinten, Dimitri
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorAbsil, Philippe
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T15:50:23Z
dc.date.available2021-10-23T15:50:23Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27427
dc.sourceIIOimport
dc.titleImpact of wafer thinning on front-end reliability for 3D integration
dc.typeProceedings paper
dc.contributor.imecauthorVaisman Chasin, Adrian
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorPotoms, Goedele
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorAbsil, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVaisman Chasin, Adrian::0000-0002-9940-0260
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage6B.2
dc.source.conferenceIEEE Reliability Physics Symposium - IRPS
dc.source.conferencedate17/04/2016
dc.source.conferencelocationPasadena, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=7574562
imec.availabilityPublished - open access


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