dc.contributor.author | van der Veen, Marleen | |
dc.contributor.author | Inoue, Fumihiro | |
dc.contributor.author | Vandersmissen, Kevin | |
dc.contributor.author | Dictus, Dries | |
dc.contributor.author | Tanaka, Tetsu | |
dc.contributor.author | Boemmels, Juergen | |
dc.contributor.author | Struyf, Herbert | |
dc.contributor.author | Tokei, Zsolt | |
dc.date.accessioned | 2021-10-23T16:01:01Z | |
dc.date.available | 2021-10-23T16:01:01Z | |
dc.date.issued | 2016 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/27450 | |
dc.source | IIOimport | |
dc.title | Conformal Cu electroless seed on Co and Ru liners enables Cu fill by plating for advanced interconnects | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | van der Veen, Marleen | |
dc.contributor.imecauthor | Inoue, Fumihiro | |
dc.contributor.imecauthor | Vandersmissen, Kevin | |
dc.contributor.imecauthor | Dictus, Dries | |
dc.contributor.imecauthor | Boemmels, Juergen | |
dc.contributor.imecauthor | Struyf, Herbert | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.orcidimec | van der Veen, Marleen::0000-0002-9402-8922 | |
dc.contributor.orcidimec | Dictus, Dries::0000-0002-7896-1747 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | MT1 | |
dc.source.conference | 25th Advanced Materials for Metalization Conference - MAM | |
dc.source.conferencedate | 21/03/2016 | |
dc.source.conferencelocation | Brussel Belgium | |
imec.availability | Published - open access | |