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How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance

dc.contributor.authorVandevelde, Bart
dc.contributor.authorDegrendele, Lieven
dc.contributor.authorCauwe, Maarten
dc.contributor.authorAllaert, Bart
dc.contributor.authorLauwaert, Ralph
dc.contributor.authorWillems, Geert
dc.date.accessioned2021-10-23T16:17:19Z
dc.date.available2021-10-23T16:17:19Z
dc.date.issued2016-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27485
dc.sourceIIOimport
dc.titleHow the mold compound thermal expansion overrules the solder composition choice in board level reliability performance
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorDegrendele, Lieven
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage94
dc.source.endpage98
dc.source.conferenceInternational Conference on Electronics Packaging - ICEP
dc.source.conferencedate20/04/2016
dc.source.conferencelocationSapporo Japan
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7486790
imec.availabilityPublished - open access


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