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On the feasibility of die-to-wafer inorganic dielectric bonding

dc.contributor.authorWang, Teng
dc.contributor.authorPodpod, Arnita
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorPeng, Lan
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorBex, Pieter
dc.contributor.authorDubey, Vikas
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-23T17:05:09Z
dc.date.available2021-10-23T17:05:09Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27576
dc.sourceIIOimport
dc.titleOn the feasibility of die-to-wafer inorganic dielectric bonding
dc.typeProceedings paper
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage5
dc.source.conference6th Electronics System-Integration Technology Conference - ESTC
dc.source.conferencedate13/09/2016
dc.source.conferencelocationGrenoble France
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7764694
imec.availabilityPublished - open access


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