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Process options to enable (Sub-)1e-9 Ohm.cm2 contact resistivity on Si devices

dc.contributor.authorYu, Hao
dc.contributor.authorSchaekers, Marc
dc.contributor.authorDemuynck, Steven
dc.contributor.authorRosseel, Erik
dc.contributor.authorEveraert, Jean-Luc
dc.contributor.authorChew, Soon Aik
dc.contributor.authorPeter, Antony
dc.contributor.authorKubicek, Stefan
dc.contributor.authorBarla, Kathy
dc.contributor.authorMocuta, Anda
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorCollaert, Nadine
dc.contributor.authorThean, Aaron
dc.contributor.authorDe Meyer, Kristin
dc.date.accessioned2021-10-23T17:37:29Z
dc.date.available2021-10-23T17:37:29Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27639
dc.sourceIIOimport
dc.titleProcess options to enable (Sub-)1e-9 Ohm.cm2 contact resistivity on Si devices
dc.typeProceedings paper
dc.contributor.imecauthorYu, Hao
dc.contributor.imecauthorSchaekers, Marc
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorEveraert, Jean-Luc
dc.contributor.imecauthorPeter, Antony
dc.contributor.imecauthorKubicek, Stefan
dc.contributor.imecauthorBarla, Kathy
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorThean, Aaron
dc.contributor.imecauthorDe Meyer, Kristin
dc.contributor.orcidimecYu, Hao::0000-0002-1976-0259
dc.contributor.orcidimecSchaekers, Marc::0000-0002-1496-7816
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage66
dc.source.endpage68
dc.source.conferenceIEEE International Interconnect Technology Conference / Advanced Metallization Conference - IITC/AMC)
dc.source.conferencedate23/05/2016
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7507683
imec.availabilityPublished - open access


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