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dc.contributor.authorZhang, Liping
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorHeylen, Nancy
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorCroes, Kristof
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorLefferts, S.
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorBaklanov, Mikhaïl
dc.date.accessioned2021-10-23T17:50:33Z
dc.date.available2021-10-23T17:50:33Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27662
dc.sourceIIOimport
dc.titleToward successful integration of gap-filling ultralow-k dielectrics
dc.typeProceedings paper
dc.contributor.imecauthorZhang, Liping
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage21
dc.source.endpage23
dc.source.conferenceIEEE International Interconnect Technology Conference / Advanced Metallization Conference - IITC/AMC
dc.source.conferencedate23/05/2016
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7507645
imec.availabilityPublished - open access


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