dc.contributor.author | Zhang, Liping | |
dc.contributor.author | de Marneffe, Jean-Francois | |
dc.contributor.author | Lesniewska, Alicja | |
dc.contributor.author | Verdonck, Patrick | |
dc.contributor.author | Heylen, Nancy | |
dc.contributor.author | Murdoch, Gayle | |
dc.contributor.author | Croes, Kristof | |
dc.contributor.author | Tokei, Zsolt | |
dc.contributor.author | Boemmels, Juergen | |
dc.contributor.author | Lefferts, S. | |
dc.contributor.author | De Gendt, Stefan | |
dc.contributor.author | Baklanov, Mikhaïl | |
dc.date.accessioned | 2021-10-23T17:50:33Z | |
dc.date.available | 2021-10-23T17:50:33Z | |
dc.date.issued | 2016 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/27662 | |
dc.source | IIOimport | |
dc.title | Toward successful integration of gap-filling ultralow-k dielectrics | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Zhang, Liping | |
dc.contributor.imecauthor | de Marneffe, Jean-Francois | |
dc.contributor.imecauthor | Lesniewska, Alicja | |
dc.contributor.imecauthor | Verdonck, Patrick | |
dc.contributor.imecauthor | Heylen, Nancy | |
dc.contributor.imecauthor | Murdoch, Gayle | |
dc.contributor.imecauthor | Croes, Kristof | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.imecauthor | Boemmels, Juergen | |
dc.contributor.imecauthor | De Gendt, Stefan | |
dc.contributor.orcidimec | Lesniewska, Alicja::0000-0003-3863-065X | |
dc.contributor.orcidimec | Verdonck, Patrick::0000-0003-2454-0602 | |
dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
dc.contributor.orcidimec | De Gendt, Stefan::0000-0003-3775-3578 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 21 | |
dc.source.endpage | 23 | |
dc.source.conference | IEEE International Interconnect Technology Conference / Advanced Metallization Conference - IITC/AMC | |
dc.source.conferencedate | 23/05/2016 | |
dc.source.conferencelocation | San Jose, CA USA | |
dc.identifier.url | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7507645 | |
imec.availability | Published - open access | |