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Development of wafer-level adhesive bonding for fine-pitch 3-D connections

dc.contributor.authorBertheau, Julien
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorIacovo, Serena
dc.contributor.authorPeng, Lan
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-24T02:58:39Z
dc.date.available2021-10-24T02:58:39Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27839
dc.sourceIIOimport
dc.titleDevelopment of wafer-level adhesive bonding for fine-pitch 3-D connections
dc.typeMeeting abstract
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conferenceThe International Conference on Wafer Bonding - Waferbond
dc.source.conferencedate27/10/2017
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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