dc.contributor.author | Bertheau, Julien | |
dc.contributor.author | Inoue, Fumihiro | |
dc.contributor.author | Iacovo, Serena | |
dc.contributor.author | Peng, Lan | |
dc.contributor.author | Derakhshandeh, Jaber | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-24T02:58:39Z | |
dc.date.available | 2021-10-24T02:58:39Z | |
dc.date.issued | 2017 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/27839 | |
dc.source | IIOimport | |
dc.title | Development of wafer-level adhesive bonding for fine-pitch 3-D connections | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Bertheau, Julien | |
dc.contributor.imecauthor | Inoue, Fumihiro | |
dc.contributor.imecauthor | Iacovo, Serena | |
dc.contributor.imecauthor | Peng, Lan | |
dc.contributor.imecauthor | Derakhshandeh, Jaber | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Iacovo, Serena::0000-0002-0826-9165 | |
dc.contributor.orcidimec | Peng, Lan::0000-0003-1824-126X | |
dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | yes | |
dc.source.conference | The International Conference on Wafer Bonding - Waferbond | |
dc.source.conferencedate | 27/10/2017 | |
dc.source.conferencelocation | Leuven Belgium | |
imec.availability | Published - imec | |