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Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements

dc.contributor.authorBeyne, Sofie
dc.contributor.authorCroes, Kristof
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorQi, Q.
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-24T02:59:44Z
dc.date.available2021-10-24T02:59:44Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27850
dc.sourceIIOimport
dc.titleStudy of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Sofie
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage3
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate16/05/2017
dc.source.conferencelocationHsinchu Taiwan
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7968946/
imec.availabilityPublished - open access


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