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Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements
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Authors
Beyne, Sofie
;
Croes, Kristof
;
van der Veen, Marleen
;
Varela Pedreira, Olalla
;
Qi, Q.
;
De Wolf, Ingrid
;
Tokei, Zsolt
Conference
IEEE International Interconnect Technology Conference - IITC
Title
Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements
Publication type
Proceedings paper
Embargo date
9999-12-31
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