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Influence of contact area on oxide-oxide fusion bonding quality between 200mm quartz and silicon wafers

dc.contributor.authorBuja, Federico
dc.contributor.authorHumbert, Aurelie
dc.contributor.authorVisker, Jakob
dc.contributor.authorPeng, Lan
dc.date.accessioned2021-10-24T03:12:04Z
dc.date.available2021-10-24T03:12:04Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/27942
dc.sourceIIOimport
dc.titleInfluence of contact area on oxide-oxide fusion bonding quality between 200mm quartz and silicon wafers
dc.typeOral presentation
dc.contributor.imecauthorHumbert, Aurelie
dc.contributor.imecauthorVisker, Jakob
dc.contributor.imecauthorPeng, Lan
dc.contributor.orcidimecHumbert, Aurelie::0000-0002-2538-8991
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.source.peerreviewno
dc.source.conferenceInternational Conference on Wafer Bonding - WAFERBOND
dc.source.conferencedate27/11/2017
dc.source.conferencelocationLeuven Belgium
dc.identifier.urlhttp://www.waferbond-conference2017.org/index.php/topics/2-uncategorised/13-posters-waferbond-conference
imec.availabilityPublished - imec
imec.internalnotesPoster 06


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