dc.contributor.author | Cavaco, Celso | |
dc.contributor.author | Peng, Lan | |
dc.contributor.author | Guerrieri, Stefano | |
dc.contributor.author | Osman, Haris | |
dc.date.accessioned | 2021-10-24T03:20:03Z | |
dc.date.available | 2021-10-24T03:20:03Z | |
dc.date.issued | 2017 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/27985 | |
dc.source | IIOimport | |
dc.title | Hybrid copper dielectric direct bonding of 200mm CMOS wafers with five metal levels: morphologic, electrical and reliability characterization | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Cavaco, Celso | |
dc.contributor.imecauthor | Peng, Lan | |
dc.contributor.imecauthor | Osman, Haris | |
dc.contributor.orcidimec | Cavaco, Celso::0000-0001-9079-338X | |
dc.contributor.orcidimec | Peng, Lan::0000-0003-1824-126X | |
dc.source.peerreview | yes | |
dc.source.conference | International Wafer-Level Packaging Conference - IWLP | |
dc.source.conferencedate | 24/10/2017 | |
dc.source.conferencelocation | San Jose, CA USA | |
imec.availability | Published - imec | |