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Low damage ULK etching by means of high boiling point organic condensation

dc.contributor.authorChanson, Romain
dc.contributor.authorHoltzer, Nicolas
dc.contributor.authorLefaucheux, Philippe
dc.contributor.authorDussart, Rémi
dc.contributor.authorSHEN, Peng
dc.contributor.authorURABE, Keiichiro
dc.contributor.authorDussarat, Christian
dc.contributor.authorMaekawa, Kaoru
dc.contributor.authoryatsuda, koichi
dc.contributor.authorTahara, Shigeru
dc.contributor.authorde Marneffe, Jean-Francois
dc.date.accessioned2021-10-24T03:23:00Z
dc.date.available2021-10-24T03:23:00Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28001
dc.sourceIIOimport
dc.titleLow damage ULK etching by means of high boiling point organic condensation
dc.typeMeeting abstract
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.source.peerreviewno
dc.source.beginpageED9.3.03
dc.source.conferenceMaterials Research Society Spring Meeting
dc.source.conferencedate17/04/2017
dc.source.conferencelocationPhoenix, AZ USA
dc.identifier.urlhttps://mrsspring.zerista.com/event/member/365505
imec.availabilityPublished - imec


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