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3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures

dc.contributor.authorDe Preter, Inge
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorNagano, Fuya
dc.contributor.authorHoushmand Sharifi, Shamin
dc.contributor.authorHou, Lin
dc.contributor.authorBex, Pieter
dc.contributor.authorSuhard, Samuel
dc.contributor.authorShibata, Toshiaki
dc.contributor.authorYukinori, Oda
dc.contributor.authorHashimoto, Shigeo
dc.contributor.authorLieten, Ruben
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-24T03:54:15Z
dc.date.available2021-10-24T03:54:15Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28150
dc.sourceIIOimport
dc.title3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
dc.typeProceedings paper
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorNagano, Fuya
dc.contributor.imecauthorHoushmand Sharifi, Shamin
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorLieten, Ruben
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage3
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate16/05/2017
dc.source.conferencelocationHsinchu Taiwan
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7968950/
imec.availabilityPublished - open access


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