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Influence of wafer-to-wafer bond alignment on via-last patterning for 3DSOC applications

dc.contributor.authorDe Vos, Joeri
dc.contributor.authorPeng, Lan
dc.contributor.authorVan Ongeval, Joost
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorKurz, Florian
dc.contributor.authorWagenleiter, Thomas
dc.contributor.authorWimplinger, Markus
dc.contributor.authorUhrmann, Thomas
dc.date.accessioned2021-10-24T04:00:03Z
dc.date.available2021-10-24T04:00:03Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28174
dc.sourceIIOimport
dc.titleInfluence of wafer-to-wafer bond alignment on via-last patterning for 3DSOC applications
dc.typeMeeting abstract
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorVan Ongeval, Joost
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conferenceThe International Conference on Wafer Bonding - Waferbond
dc.source.conferencedate27/11/2017
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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