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One micron redistribution for fan-out wafer level packaging

dc.contributor.authorFlack, Warren
dc.contributor.authorHsieh, Robert
dc.contributor.authorNguyen, Ha-Ai
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorLorant, Christophe
dc.contributor.authorMiller, Andy
dc.date.accessioned2021-10-24T04:44:17Z
dc.date.available2021-10-24T04:44:17Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28336
dc.sourceIIOimport
dc.titleOne micron redistribution for fan-out wafer level packaging
dc.typeProceedings paper
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorLorant, Christophe
dc.contributor.imecauthorMiller, Andy
dc.contributor.orcidimecLorant, Christophe::0000-0001-7363-9348
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage7
dc.source.conferenceIEEE 19th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate6/12/2017
dc.source.conferencelocationSingapore Singapore
dc.identifier.urlhttp://ieeexplore.ieee.org/document/8277536/
imec.availabilityPublished - open access


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