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SEM based overlay measurement between via patterns and buried M1 patterns using high voltage SEM

dc.contributor.authorHasumi, Kazuhisa
dc.contributor.authorInoue, Osamu
dc.contributor.authorOkagawa, Yutaka
dc.contributor.authorShao, Chuanyu
dc.contributor.authorLeray, Philippe
dc.contributor.authorHalder, Sandip
dc.contributor.authorLorusso, Gian
dc.contributor.authorJehoul, Christiane
dc.date.accessioned2021-10-24T05:29:03Z
dc.date.available2021-10-24T05:29:03Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28465
dc.sourceIIOimport
dc.titleSEM based overlay measurement between via patterns and buried M1 patterns using high voltage SEM
dc.typeProceedings paper
dc.contributor.imecauthorLeray, Philippe
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorLorusso, Gian
dc.contributor.imecauthorJehoul, Christiane
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.date.embargo9999-12-31
dc.identifier.doi10.1117/12.2257848
dc.source.peerreviewyes
dc.source.beginpage101451J
dc.source.conferenceMetrology, Inspection, and Process Control for Microlithography XXXI
dc.source.conferencedate26/02/2017
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - open access
imec.internalnotesProceedings of SPIE; Vol.10145


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