dc.contributor.author | Heylen, Nancy | |
dc.contributor.author | Kim, Soon-Wook | |
dc.contributor.author | Kim, Tae-Gon | |
dc.contributor.author | Peng, Lan | |
dc.contributor.author | Nolmans, Philip | |
dc.contributor.author | Struyf, Herbert | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Beyne, Sofie | |
dc.date.accessioned | 2021-10-24T05:41:28Z | |
dc.date.available | 2021-10-24T05:41:28Z | |
dc.date.issued | 2017 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/28500 | |
dc.source | IIOimport | |
dc.title | Nanotopography control for wafer-to-wafer hybrid bonding by CMP | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Heylen, Nancy | |
dc.contributor.imecauthor | Kim, Soon-Wook | |
dc.contributor.imecauthor | Peng, Lan | |
dc.contributor.imecauthor | Nolmans, Philip | |
dc.contributor.imecauthor | Struyf, Herbert | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Beyne, Sofie | |
dc.contributor.orcidimec | Peng, Lan::0000-0003-1824-126X | |
dc.source.peerreview | yes | |
dc.source.conference | International Conference on Planarization / CMP Technology - ICPT 2017 | |
dc.source.conferencedate | 11/10/2017 | |
dc.source.conferencelocation | Leuven Belgium | |
dc.identifier.url | http://conference.vde.com/icpt/cfp/Documents/ICPT%202017%20Program.pdf | |
imec.availability | Published - imec | |