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Mechanical stress evolution and the Blech length: 2D simulation of early electromigration effects
Publication:
Mechanical stress evolution and the Blech length: 2D simulation of early electromigration effects
Date
1998
Journal article
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2731.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Petrescu, Violeta
;
Mouthaan, T.
;
Schoenmaker, Wim
;
Salm, C.
Journal
Microelectronics Reliability
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1906
since deposited on 2021-10-01
Acq. date: 2025-10-25
Citations
Metrics
Views
1906
since deposited on 2021-10-01
Acq. date: 2025-10-25
Citations