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Comparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stacking

dc.contributor.authorHoushmand Sharifi, Shamin
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorArmini, Silvia
dc.contributor.authorDe Preter, Inge
dc.contributor.authorBex, Pieter
dc.contributor.authorHou, Lin
dc.contributor.authorBartha, Johan W
dc.contributor.authorNeumann, Volker
dc.contributor.authorHerregods, Sebastiaan
dc.contributor.authorNagano, Fuya
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-24T05:53:48Z
dc.date.available2021-10-24T05:53:48Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28531
dc.sourceIIOimport
dc.titleComparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stacking
dc.typeMeeting abstract
dc.contributor.imecauthorHoushmand Sharifi, Shamin
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorHerregods, Sebastiaan
dc.contributor.imecauthorNagano, Fuya
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conferenceMaterials for Advanced Metallization Conference - MAM
dc.source.conferencedate26/03/2017
dc.source.conferencelocationDresden Germany
imec.availabilityPublished - imec


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