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Study of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments

dc.contributor.authorIwasaki, Akihisa
dc.contributor.authorAkanishi, Yuya
dc.contributor.authorMatsumoto, Fulvio
dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorHolsteyns, Frank
dc.date.accessioned2021-10-24T06:10:30Z
dc.date.available2021-10-24T06:10:30Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28574
dc.sourceIIOimport
dc.titleStudy of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments
dc.typeMeeting abstract
dc.contributor.imecauthorAkanishi, Yuya
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.source.peerreviewyes
dc.source.beginpage1079
dc.source.conference232nd ECS Fall Meeting: 15th International Symposium on Semiconductor Cleaning Science and Technology - SCST15
dc.source.conferencedate1/10/2017
dc.source.conferencelocationNational Harbor, MD USA
dc.identifier.urlhttp://ma.ecsdl.org/content/MA2017-02/24/1079.abstract
imec.availabilityPublished - imec
imec.internalnotesECS Meeting Abstracts; Vol. MA2017-02


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