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Study of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments

dc.contributor.authorIwasaki, Akihisa
dc.contributor.authorAkanishi, Yuya
dc.contributor.authorMazzamuto, Fulvio
dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorHolsteyns, Frank
dc.date.accessioned2021-10-24T06:10:55Z
dc.date.available2021-10-24T06:10:55Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28575
dc.sourceIIOimport
dc.titleStudy of copper surface preparation by sequential atomic layer wet etching and laser annealing treatments
dc.typeProceedings paper
dc.contributor.imecauthorAkanishi, Yuya
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage233
dc.source.endpage241
dc.source.conference232nd ECS Fall Meeting - 15th International Symposium on Semiconductor Cleaning Science and Technology - SCST15
dc.source.conferencedate1/10/2017
dc.source.conferencelocationNational Harbor, MD USA
dc.identifier.urlhttp://ecst.ecsdl.org/content/80/2/233.abstract
imec.availabilityPublished - open access
imec.internalnotesEST Transactions; Vol. 80, Issue 2


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