Toggle navigation
My submissions
Login
Toggle navigation
View item
imec Publications Repository
imec Publications
Dissertations
View item
imec Publications Repository
imec Publications
Dissertations
View item
JavaScript is disabled for your browser. Some features of this site may not work without it.
Strength and Reliability Characterization of Multi-Level Back-End-of-Line under Chip Package Interaction Loading
View/
open
43169.pdf (10.83Mb)
Metadata
Show full item record
Authors
Kljucar, Luka
Supervisor
De Wolf, Ingrid; Wevers, Martine
Title
Strength and Reliability Characterization of Multi-Level Back-End-of-Line under Chip Package Interaction Loading
Publication type
PHD thesis
Embargo date
9999-12-31
Collections
Dissertations
Search imec Publications Repository
This collection
Browse
All of imec Publications Repository
Collections
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
This collection
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
My account
login