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In-situ monitoring of field conditions and interconnect integrity for an electronic on-board module

dc.contributor.authorLabie, Riet
dc.contributor.authorVandevelde, Bart
dc.contributor.authorVan Meensel, Wesley
dc.contributor.authorVogeleer, Mike
dc.contributor.authorWerkhoven, Daniel
dc.contributor.authorAllaert, Bart
dc.contributor.authorWillems, Geert
dc.date.accessioned2021-10-24T07:18:57Z
dc.date.available2021-10-24T07:18:57Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28733
dc.sourceIIOimport
dc.titleIn-situ monitoring of field conditions and interconnect integrity for an electronic on-board module
dc.typeProceedings paper
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorVan Meensel, Wesley
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVan Meensel, Wesley::0000-0002-8631-4793
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage5
dc.source.conference18th Int. Conf. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - EuroSimE
dc.source.conferencedate2/04/2017
dc.source.conferencelocationDresden Germany
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7926267/
imec.availabilityPublished - open access


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