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N5 BEOL process options patterning flows comparing 193immersion to hybrid EUV or full EUV

dc.contributor.authorLariviere, Stephane
dc.contributor.authorBriggs, Basoene
dc.contributor.authorWilson, Chris
dc.contributor.authorMallik, Arindam
dc.contributor.authorDecoster, Stefan
dc.contributor.authorWan, Danny
dc.contributor.authorBekaert, Joost
dc.contributor.authorBlanco, Victor
dc.contributor.authorMao, Ming
dc.contributor.authorPaolillo, Sara
dc.contributor.authorKutrzeba Kotowska, Bogumila
dc.contributor.authorVersluijs, Janko
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTrivkovic, Darko
dc.contributor.authorTokei, Zsolt
dc.contributor.authorMcIntyre, Greg
dc.contributor.authorMocuta, Dan
dc.date.accessioned2021-10-24T07:29:51Z
dc.date.available2021-10-24T07:29:51Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28759
dc.sourceIIOimport
dc.titleN5 BEOL process options patterning flows comparing 193immersion to hybrid EUV or full EUV
dc.typeProceedings paper
dc.contributor.imecauthorLariviere, Stephane
dc.contributor.imecauthorBriggs, Basoene
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorMallik, Arindam
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorWan, Danny
dc.contributor.imecauthorBekaert, Joost
dc.contributor.imecauthorBlanco, Victor
dc.contributor.imecauthorMao, Ming
dc.contributor.imecauthorPaolillo, Sara
dc.contributor.imecauthorKutrzeba Kotowska, Bogumila
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTrivkovic, Darko
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecMallik, Arindam::0000-0002-0742-9366
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecWan, Danny::0000-0003-4847-3184
dc.contributor.orcidimecBekaert, Joost::0000-0003-3075-3479
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage385
dc.source.endpage386
dc.source.conference49th International Conferece on Solid State Devices and Materials - SSDM
dc.source.conferencedate19/09/2017
dc.source.conferencelocationSendai Japan
imec.availabilityPublished - open access


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