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In-line metrology for characterization and control of extreme wafer thinning of bonded wafers

dc.contributor.authorLiebens, Maarten
dc.contributor.authorJourdain, Anne
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorVandeweyer, Tom
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorLi, Shifang
dc.contributor.authorBast, G.
dc.contributor.authorStoerring, Moritz
dc.contributor.authorHiebert, S.
dc.contributor.authorCross, Andrew
dc.date.accessioned2021-10-24T07:59:49Z
dc.date.available2021-10-24T07:59:49Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28825
dc.sourceIIOimport
dc.titleIn-line metrology for characterization and control of extreme wafer thinning of bonded wafers
dc.typeProceedings paper
dc.contributor.imecauthorLiebens, Maarten
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorVandeweyer, Tom
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorStoerring, Moritz
dc.contributor.imecauthorCross, Andrew
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage331
dc.source.endpage336
dc.source.conference28th Annual SEMI Advanced Semiconductor Manufacturing Conference - ASMC
dc.source.conferencedate15/05/2017
dc.source.conferencelocationSaratoga Springs, NY USA
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7969255/
imec.availabilityPublished - open access


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