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A new scaling issue in the electrical behavior of damascene versus plasma-etched interconnects

dc.contributor.authorProost, Joris
dc.contributor.authorConard, Thierry
dc.contributor.authorBoullart, Werner
dc.contributor.authorGrillaert, Joost
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-01T08:43:48Z
dc.date.available2021-10-01T08:43:48Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2882
dc.sourceIIOimport
dc.titleA new scaling issue in the electrical behavior of damascene versus plasma-etched interconnects
dc.typeProceedings paper
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage535
dc.source.endpage541
dc.source.conferenceProceedings Advanced Metallization and Interconnect Systems for ULSI Applications in 1997
dc.source.conferencedate30/09/1997
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - open access
imec.internalnotesMRS Conference Proceedings; Vol. ULSI XII


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