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Electromigration behaviour of 0.3 μm damascene vs. plasma-etched interconnects: a lifetime and drift analysis

dc.contributor.authorProost, Joris
dc.contributor.authorLi, Hua
dc.contributor.authorBrijs, Bert
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-10-01T08:44:08Z
dc.date.available2021-10-01T08:44:08Z
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/2884
dc.sourceIIOimport
dc.titleElectromigration behaviour of 0.3 μm damascene vs. plasma-etched interconnects: a lifetime and drift analysis
dc.typeProceedings paper
dc.contributor.imecauthorMaex, Karen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage110
dc.source.endpage112
dc.source.conferenceProceedings of the IEEE 1998 International Interconnect Technology Conference
dc.source.conferencedate1/06/1998
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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