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The impact of sequential-3D integration on semiconductor scaling roadmap
Publication:
The impact of sequential-3D integration on semiconductor scaling roadmap
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Date
2017
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Mallik, Arindam
;
Vandooren, Anne
;
Witters, Liesbeth
;
Walke, Amey
;
Franco, Jacopo
;
Sherazi, Yasser
;
Weckx, Pieter
;
Yakimets, Dmitry
;
Garcia Bardon, Marie
;
Parvais, Bertrand
;
Debacker, Peter
;
Ku, B.W.
;
Lim, S.K.
;
Mocuta, Anda
;
Mocuta, Dan
;
Ryckaert, Julien
;
Collaert, Nadine
;
Raghavan, Praveen
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1976
since deposited on 2021-10-24
1
last month
Acq. date: 2026-01-09
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1976
since deposited on 2021-10-24
1
last month
Acq. date: 2026-01-09
Citations