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The impact of sequential-3D integration on semiconductor scaling roadmap

dc.contributor.authorMallik, Arindam
dc.contributor.authorVandooren, Anne
dc.contributor.authorWitters, Liesbeth
dc.contributor.authorWalke, Amey
dc.contributor.authorFranco, Jacopo
dc.contributor.authorSherazi, Yasser
dc.contributor.authorWeckx, Pieter
dc.contributor.authorYakimets, Dmitry
dc.contributor.authorGarcia Bardon, Marie
dc.contributor.authorParvais, Bertrand
dc.contributor.authorDebacker, Peter
dc.contributor.authorKu, B.W.
dc.contributor.authorLim, S.K.
dc.contributor.authorMocuta, Anda
dc.contributor.authorMocuta, Dan
dc.contributor.authorRyckaert, Julien
dc.contributor.authorCollaert, Nadine
dc.contributor.authorRaghavan, Praveen
dc.date.accessioned2021-10-24T08:39:19Z
dc.date.available2021-10-24T08:39:19Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28905
dc.sourceIIOimport
dc.titleThe impact of sequential-3D integration on semiconductor scaling roadmap
dc.typeProceedings paper
dc.contributor.imecauthorMallik, Arindam
dc.contributor.imecauthorVandooren, Anne
dc.contributor.imecauthorWitters, Liesbeth
dc.contributor.imecauthorWalke, Amey
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorSherazi, Yasser
dc.contributor.imecauthorWeckx, Pieter
dc.contributor.imecauthorYakimets, Dmitry
dc.contributor.imecauthorGarcia Bardon, Marie
dc.contributor.imecauthorParvais, Bertrand
dc.contributor.imecauthorDebacker, Peter
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.orcidimecMallik, Arindam::0000-0002-0742-9366
dc.contributor.orcidimecVandooren, Anne::0000-0002-2412-0176
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecParvais, Bertrand::0000-0003-0769-7069
dc.contributor.orcidimecDebacker, Peter::0000-0003-3825-5554
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.source.peerreviewyes
dc.source.beginpage717
dc.source.endpage720
dc.source.conferenceIEEE International Electron Device Meeting - IEDM
dc.source.conferencedate2/12/2017
dc.source.conferencelocationSan Francisco, CA USA
dc.identifier.urlhttp://ieeexplore.ieee.org/document/8268483/
imec.availabilityPublished - imec


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