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Conference contributions
Testing of 2.5D- and 3D-stacked integrated circuits
Publication:
Testing of 2.5D- and 3D-stacked integrated circuits
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Date
2017-09
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Marinissen, Erik Jan
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1811
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Acq. date: 2026-01-08
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Views
1811
since deposited on 2021-10-24
1
last month
Acq. date: 2026-01-08
Citations