| dc.contributor.author | Palmans, Roger | |
| dc.contributor.author | Maex, Karen | |
| dc.date.accessioned | 2021-09-29T12:45:10Z | |
| dc.date.available | 2021-09-29T12:45:10Z | |
| dc.date.issued | 1994 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/290 | |
| dc.source | IIOimport | |
| dc.title | Development of an electroless copper deposition bath for via fill applications on TiN seed layers | |
| dc.type | Oral presentation | |
| dc.contributor.imecauthor | Maex, Karen | |
| dc.source.peerreview | no | |
| dc.source.conference | MRS Conference on Advanced Metallization for ULSI Applications; October 6-8, 1994; Austin, Texas, USA. | |
| dc.source.conferencedate | 6/10/1994 | |
| dc.source.conferencelocation | Austin, TX USA | |
| imec.availability | Published - imec | |
| imec.internalnotes | to be publ. 1995. See C784 | |
