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Thermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits

dc.contributor.authorOkudur, Oguzhan Orkut
dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorGonzalez, Mario
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorVanstreels, Kris
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-24T10:22:23Z
dc.date.available2021-10-24T10:22:23Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29105
dc.sourceIIOimport
dc.titleThermomechanical aspects of wafer-to-wafer copper-dielectric hybrid bonding for 3D integrated circuits
dc.typeMeeting abstract
dc.contributor.imecauthorOkudur, Oguzhan Orkut
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecOkudur, Oguzhan Orkut::0000-0002-4790-7772
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecDe Messemaeker, Joke::0000-0002-4872-0176
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.contributor.orcidimecZahedmanesh, Houman::0000-0002-0290-691X
dc.contributor.orcidimecVarela Pedreira, Olalla::0000-0002-2987-1972
dc.source.peerreviewyes
dc.source.conferenceThe International Conference on Wafer Bonding - Waferbond
dc.source.conferencedate27/11/2017
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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