dc.contributor.author | Phommahaxay, Alain | |
dc.contributor.author | Guerrero, Alice | |
dc.contributor.author | Jourdain, Anne | |
dc.contributor.author | Potoms, Goedele | |
dc.contributor.author | Verbinnen, Greet | |
dc.contributor.author | Bai, Dongshun | |
dc.contributor.author | Yess, Kim | |
dc.contributor.author | Arnold, Kim | |
dc.contributor.author | Sleeckx, Erik | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-24T11:00:21Z | |
dc.date.available | 2021-10-24T11:00:21Z | |
dc.date.issued | 2017 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/29174 | |
dc.source | IIOimport | |
dc.title | Advances in thin wafer debonding and ultra thin 28nm FinFET substrate transfer | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Phommahaxay, Alain | |
dc.contributor.imecauthor | Guerrero, Alice | |
dc.contributor.imecauthor | Jourdain, Anne | |
dc.contributor.imecauthor | Potoms, Goedele | |
dc.contributor.imecauthor | Verbinnen, Greet | |
dc.contributor.imecauthor | Sleeckx, Erik | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Sleeckx, Erik::0000-0003-2560-6132 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 740 | |
dc.source.endpage | 745 | |
dc.source.conference | IEEE 67th Electronic Components and Technology Conference - ECTC | |
dc.source.conferencedate | 30/05/2017 | |
dc.source.conferencelocation | Orlando, FL USA | |
dc.identifier.url | http://ieeexplore.ieee.org/document/7999771/ | |
imec.availability | Published - open access | |