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A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP

dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorNakamura, Atsushi
dc.contributor.authorPotoms, Goedele
dc.contributor.authorBertheau, Julien
dc.contributor.authorBex, Pieter
dc.contributor.authorDuval, Fabrice
dc.contributor.authorPodpod, Arnita
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorKamochi, Yoshitaka
dc.contributor.authorSawano, Mitsuru
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSleeckx, Erik
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-24T11:01:00Z
dc.date.available2021-10-24T11:01:00Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29175
dc.sourceIIOimport
dc.titleA unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP
dc.typeOral presentation
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorPotoms, Goedele
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceElectronic Components and Technology Conference - ECTC
dc.source.conferencedate30/05/2017
dc.source.conferencelocationOrlando, FL USA
imec.availabilityPublished - open access
imec.internalnotesinteractive presentation


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