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Use of 3D Xray microscopy for BEOL and advanced packaging failure analysis

dc.contributor.authorSchmidt, Christian
dc.contributor.authorKelly, Stephen T.
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-24T13:03:00Z
dc.date.available2021-10-24T13:03:00Z
dc.date.issued2017-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29389
dc.sourceIIOimport
dc.titleUse of 3D Xray microscopy for BEOL and advanced packaging failure analysis
dc.typeProceedings paper
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewyes
dc.source.beginpage508
dc.source.endpage513
dc.source.conferenceInternational Symposium on Testing and Failure analysis - ISTFA
dc.source.conferencedate5/11/2017
dc.source.conferencelocationPasadena, CA USA
imec.availabilityPublished - imec


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