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A simple and efficient RF technique for the TSV characterization

dc.contributor.authorSun, Xiao
dc.contributor.authorRoda Neve, Cesar
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-24T14:27:21Z
dc.date.available2021-10-24T14:27:21Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29524
dc.sourceIIOimport
dc.titleA simple and efficient RF technique for the TSV characterization
dc.typeProceedings paper
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1431
dc.source.endpage1436
dc.source.conference37th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate30/05/2017
dc.source.conferencelocationLake Buena Vista, FL USA
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7999868/
imec.availabilityPublished - open access


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