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Dummy gate amorphous silicon CMP using in-situ profile CLC endpoint system for advanced FinFET

dc.contributor.authorTsvetanova, Diana
dc.contributor.authorIizumi, Takeshi
dc.contributor.authorIto, Ban
dc.contributor.authorRoyere, Gael
dc.contributor.authorDurix, Fabien
dc.contributor.authorDevriendt, Katia
dc.contributor.authorOng, Patrick
dc.contributor.authorStruyf, Herbert
dc.date.accessioned2021-10-24T15:19:07Z
dc.date.available2021-10-24T15:19:07Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29606
dc.sourceIIOimport
dc.titleDummy gate amorphous silicon CMP using in-situ profile CLC endpoint system for advanced FinFET
dc.typeProceedings paper
dc.contributor.imecauthorTsvetanova, Diana
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.imecauthorOng, Patrick
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.source.peerreviewyes
dc.source.beginpage307
dc.source.endpage311
dc.source.conferenceInternational Conference on. Planarization/CMP Technology - ICPT
dc.source.conferencedate11/10/2017
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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