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Mechanistic and electrochemical aspects of copper and cobalt post CMP cleaners for 5-7 nm nodes

dc.contributor.authorWhite, Mike
dc.contributor.authorWhite, Daniela
dc.contributor.authorWang, Volley
dc.contributor.authorLiu, Jun
dc.contributor.authorThomas, Elisabeth
dc.contributor.authorFrye, Don
dc.contributor.authorLieten, Ruben
dc.contributor.authorParson, Thomas
dc.date.accessioned2021-10-24T18:53:55Z
dc.date.available2021-10-24T18:53:55Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29930
dc.sourceIIOimport
dc.titleMechanistic and electrochemical aspects of copper and cobalt post CMP cleaners for 5-7 nm nodes
dc.typeProceedings paper
dc.contributor.imecauthorLieten, Ruben
dc.contributor.imecauthorParson, Thomas
dc.source.peerreviewyes
dc.source.beginpage267
dc.source.endpage274
dc.source.conferenceSurface Preparation and Cleaning Conference - SPCC
dc.source.conferencedate28/03/2017
dc.source.conferencelocationAustin, TX USA
dc.identifier.urlhttp://toc.proceedings.com/36214webtoc.pdf
imec.availabilityPublished - imec


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