Browsing Book chapters by imec author "92235da7a6d49791e7c03410579282b135d2055c"
Now showing items 1-10 of 10
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3D integration technologies at IMEC
Beyne, Eric (2008) -
Cu TSV stress: avoiding Cu protrusion and impact on devices
Beyne, Eric; De Messemaeker, Joke; Guo, Wei (2014) -
Direct hybrid bonding
Swinnen, Bart; Jourdain, Anne; De Moor, Piet; Beyne, Eric (2008) -
Modeling and Characterization of TSV-Induced Noise Coupling
Sun, Xiao; Rack, Martin; Van der Plas, Geert; Raskin, Jean-Pierre; Beyne, Eric (2018) -
Multi-chipmodules
Beyne, Eric (1996) -
RF technologies and systems
De Raedt, Walter; Carchon, Geert; Tilmans, Harrie; Beyne, Eric (2009) -
Thermal modeling and experimental model validation for 3D stacked ICs
Oprins, Herman; Maggioni, Federica; Cherman, Vladimir; Van der Plas, Geert; Beyne, Eric (2019-04) -
Thinning, via reveal and backside processing - overview
Beyne, Eric; Jourdain, Anne; Phommahaxay, Alain (2014) -
Through-silicon via technology for 3D IC
Beyne, Eric (2011) -
Ultra-fine pitch 3D-stacked integrated circuits: technology, design enablement and application
Milojevic, Dragomir; Agrawal, Prashant; Raghavan, Praveen; Van der Plas, Geert; Catthoor, Francky; Van der Perre, Liesbet; Velenis, Dimitrios; Varadarajan, Ravi; Beyne, Eric (2019)