Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
Process-oriented modelling of stresses and mechanical confinement in advanced nano-interconnects; implications for electromigration
Publication:
Process-oriented modelling of stresses and mechanical confinement in advanced nano-interconnects; implications for electromigration
Copy permalink
Date
2017
Meeting abstract
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Zahedmanesh, Houman
;
Croes, Kristof
;
Tokei, Zsolt
Journal
Abstract
Description
Metrics
Views
1842
since deposited on 2021-10-24
4
last month
1
last week
Acq. date: 2025-12-16
Citations
Metrics
Views
1842
since deposited on 2021-10-24
4
last month
1
last week
Acq. date: 2025-12-16
Citations