Toggle navigation
My submissions
Login
Toggle navigation
View item
imec Publications Repository
imec Publications
Conference contributions
View item
imec Publications Repository
imec Publications
Conference contributions
View item
JavaScript is disabled for your browser. Some features of this site may not work without it.
Extreme thinned-wafer bonding using low temperature curable polyimide for advanced waferlevel integrations
View/
open
37075.pdf (535.4Kb)
Metadata
Show full item record
Authors
Bertheau, Julien
;
Inoue, Fumihiro
;
Phommahaxay, Alain
;
Peng, Lan
;
Iacovo, Serena
;
Rassoul, Nouredine
;
Sleeckx, Erik
;
Rebibis, Kenneth June
;
Miller, Andy
;
Beyer, Gerald
;
Beyne, Eric
;
Nakamura, Atsushi
Conference
IEEE 68th Electronic Components Technology Conference - ECTC
Title
Extreme thinned-wafer bonding using low temperature curable polyimide for advanced waferlevel integrations
Publication type
Proceedings paper
Embargo date
9999-12-31
Collections
Conference contributions
Search imec Publications Repository
This collection
Browse
All of imec Publications Repository
Collections
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
This collection
Publication date
Authors
Titles
Subjects
imec author
Availability
Publication type
My account
login