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Extreme thinned-wafer bonding using low temperature curable polyimide for advanced waferlevel integrations

dc.contributor.authorBertheau, Julien
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorPeng, Lan
dc.contributor.authorIacovo, Serena
dc.contributor.authorRassoul, Nouredine
dc.contributor.authorSleeckx, Erik
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorNakamura, Atsushi
dc.date.accessioned2021-10-25T16:43:45Z
dc.date.available2021-10-25T16:43:45Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30241
dc.sourceIIOimport
dc.titleExtreme thinned-wafer bonding using low temperature curable polyimide for advanced waferlevel integrations
dc.typeProceedings paper
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorRassoul, Nouredine
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecRassoul, Nouredine::0000-0001-9489-3396
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage86
dc.source.endpage91
dc.source.conferenceIEEE 68th Electronic Components Technology Conference - ECTC
dc.source.conferencedate29/05/2017
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/abstract/document/8429534
imec.availabilityPublished - open access


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