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Stress mitigation of 3D-stacking/packaging induced stresses

dc.contributor.authorCroes, Kristof
dc.contributor.authorCherman, Vladimir
dc.contributor.authorLofrano, Melina
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorKljucar, Luka
dc.contributor.authorGonzalez, Mario
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-25T17:29:29Z
dc.date.available2021-10-25T17:29:29Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30475
dc.sourceIIOimport
dc.titleStress mitigation of 3D-stacking/packaging induced stresses
dc.typeProceedings paper
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorKljucar, Luka
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate11/03/2018
dc.source.conferencelocationBurlingame, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8353590/
imec.availabilityPublished - open access


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