Publication:

Stress mitigation of 3D-stacking/packaging induced stresses

Date

2018

Proceedings Paper

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Files

38240.pdf 696.21 KB

Author(s)

;

Cherman, Vladimir

;

Lofrano, Melina

;

Zahedmanesh, Houman

;

;

Gonzalez, Mario

;

De Wolf, Ingrid

;

;

Statistics

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Acq. date: 2026-04-06