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Stress mitigation of 3D-stacking/packaging induced stresses
Publication:
Stress mitigation of 3D-stacking/packaging induced stresses
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Date
2018
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Croes, Kristof
;
Cherman, Vladimir
;
Lofrano, Melina
;
Zahedmanesh, Houman
;
Kljucar, Luka
;
Gonzalez, Mario
;
De Wolf, Ingrid
;
Tokei, Zsolt
;
Beyne, Eric
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Views
1861
since deposited on 2021-10-25
1
last month
Acq. date: 2025-12-15
Citations