Publication:

Stress mitigation of 3D-stacking/packaging induced stresses

Date

2018
Proceedings Paper
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dc.contributor.authorCroes, Kristof
dc.contributor.authorCherman, Vladimir
dc.contributor.authorLofrano, Melina
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorKljucar, Luka
dc.contributor.authorGonzalez, Mario
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorKljucar, Luka
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-25T17:29:29Z
dc.date.available2021-10-25T17:29:29Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30475
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8353590/
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate11/03/2018
dc.source.conferencelocationBurlingame, CA USA
dc.title

Stress mitigation of 3D-stacking/packaging induced stresses

dc.typeProceedings paper
dspace.entity.typePublication
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