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Electromigration behavior of Cu/SiCN to Cu/SiCN hybrid bonds for 3D integrated circuits

dc.contributor.authorDe Messemaeker, Joke
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorStucchi, Michele
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-25T17:45:47Z
dc.date.available2021-10-25T17:45:47Z
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30538
dc.sourceIIOimport
dc.titleElectromigration behavior of Cu/SiCN to Cu/SiCN hybrid bonds for 3D integrated circuits
dc.typeProceedings paper
dc.contributor.imecauthorDe Messemaeker, Joke
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage449
dc.source.endpage450
dc.source.conferenceInternational Conference on Solid State Devices and Materials - SSDM
dc.source.conferencedate11/09/2018
dc.source.conferencelocationTokyo Japan
imec.availabilityPublished - imec


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